Series |
Item |
Technical Sepecification |
Standard |
Advanced |
1 |
Number of layer |
1-8 Layers |
10-24 Layers |
2 |
Base Material |
FR4、Aluminum Based |
ShengyiTG170、IT180、Teflon、Rogers、FPC |
3 |
Finish Board Thickness |
0.30 mm~5.0mm |
0.20mm~6.0mm |
4 |
Minimum Core Thickness |
0.15mm(6 mil) |
0.10mm(4 mil) |
5 |
Copper Thickness |
Min. 1/2 OZ,Max.4OZ |
Min.1/4OZ,Max.15OZ |
6 |
Hole Copper Thickness |
Min.20um(0.8mil) |
Min.25um(1mil) |
7 |
Panel size |
700*500(Max) |
600*1000mm(Max) |
8 |
Min.Trace Wide&Line Space |
0.13mm(5 mil) |
0.1mm(4mil) |
9 |
Min.Hole Diameter |
Drilling/PTH |
φ0.30mm (12 mil) |
0.2mm(8 mil) |
Blind hole |
|
0.1-0.15mm(4mil) |
10 |
Aspect ratio |
6:01 |
12:01 |
11 |
Solder mask |
color |
Green、Black、White、Yellow、Blue、Red、Matte Green、Matte Black、Clear、 |
bridge |
min 0.13mm(5 mil) |
min 0.1mm(4mil) |
12 |
Dimension |
Hole Position |
0.075(3 mil) |
0.05(2 mil) |
Tolerance |
Condutor Width(W) |
20% Deviation of Master A/W |
1mil Deviation of Master A/W |
|
Hole Diameter(H) |
NPTH:+/-0.05mm(2 mil) |
NPTH:+/-0.05mm(2mil) |
|
PTH:+/-0.075(3 mil) |
PTH:+/-0.05mm(2 mil ) |
|
Outline Dimension |
0.15mm (6 mil) |
0.10 mm(4 mil) |
|
Conduotors&Outline(C-O) |
0.15mm (6 mil) |
0.13 mm(5 mil) |
|
Warp and Twist |
0.75% |
0.50% |
13 |
Surface Treatment |
|
|
|
|
Leadfree HASL |
3um(min) |
Leadfree HASL |
3um(min) |
OSP |
0.2-0.5um |
OSP |
0.2-0.5um |
Immersion Silver |
0.15-0.5um |
Immersion Silver |
0.15-0.5um |
Immersion Tin |
0.8-1.2um |
Immersion Tin |
0.8-1.2um |
Immersion Gold |
Au 1-3u" |
Immersion Gold |
Au 1-10u" |
|
|
Hard Gold |
Au 5-50u" |
|
|
selective gold |
Au 3-150u" |
|
|
Ni/Pd/Au |
Pd 4u" Au 4u" |
14 |
V-cut |
Board Thickness |
min0.40mm(20mil). |
min.0.30mm(12mil) |
Remain Thickness |
1/3 board thickness |
|
Tolerance |
±0.13mm(5 mil) |
±0.1mm(4mil) |
Groove Width |
0.50 mm(20 mil) max. |
0.38mm(15mil) max. |
Groove to Groove |
20mm(787 m il) min. |
10mm(394mil) min. |
Groove to Trace |
0.45mm(18 mil) min. |
0.38mm(15mil) min. |
15 |
Slot |
Slot size tol.L≥2W |
PTH Slot:L;+/-0.13(5mil)W:+/-0.08(3 mil) |
PTH Slot;L :+/-0.10(4mil) |
W:+/-0.05(2 mil) |
NPTH slot(mm)L+/-0.10(4mil) |
NPTH slot(mm)L:+/-0.08(3mil)W:+/-0.05(2 mil) |
16 |
Min Spaceing from hole edge to hole edge |
0.30-1.60(Hole Diameter) |
0.15mm(6 mil) |
0.10mm(4 mil) |
1.61-6.50(Hole Diameter) |
0.15mm(6 mil) |
0.13mm(5 mil) |
17 |
Minimum spacing between hole edge to circuitry pattern |
PTH hole:0.20mm(8mil) |
PTH hole:0.13mm(5mil) |
PTH hole:0.13(5mil) |
|
NPTH hole:0.10mm(4mil) |
NPTH hole:0.10(4mil) |
18 |
Multilayers |
Layer-layer misregistration |
4layers: |
0.15mm(6mil)max. |
4layers: |
0.10mm(4mil)max. |
6layers: |
0.20mm(8mil)max. |
6layers: |
0.13mm(5mil)max. |
8layers: |
0.25mm(9mil)max. |
8layers: |
0.15mm(6mil)max. |
Min.Spacing From Hole Edge to Innerlayer Pattern |
0.225mm(9mil) |
0.15mm(6mil) |
Min.Spacing From Outline to Innerlayer Pattern |
0.38mm(15mil) |
0.225mm(9mil) |
Min. board thickness |
4layers:0.40mm(16mil) |
4layers:0.30mm(112mil) |
6layers:0.60mm(24mil) |
6layers:0.50mm(20mil) |
8layers:1.0mm(40mil) |
8layers:0.75mm(30mil) |
Board thickness tolerance |
4layers:+/-0.13mm(5mil) |
4layers:+/-0.10mm(4mil) |
6layers:+/-0.15mm(6mil) |
6layers:+/-0.13mm(5mil) |
8-12 layers:+/-0.20mm(8mil) |
8-12 layers:+/-0.15mm(6mil) |
19 |
Insulation Resistance |
10KΩ~20MΩ(typical:5MΩ) |
|
20 |
Conductivity |
<50Ω(typical:25Ω) |
|
21 |
Test voltage |
250V |
|
22 |
Impedance control |
Typical: 50Ω+/-10% |
|